Pack

HanoiPrintPack 2025: Demonstrating smart technologies, printing and packaging

Hà Nội Mới

02/07/2025

By 2030, Da Nang will be one of the three major centers for microchip and semiconductor design.

Việt Nam

18/12/2024

Bringing sidewalk noodle soup to America

Báo Tuổi Trẻ

24/10/2024

Selectively attract FDI, striving to become one of the global semiconductor human resource centers

Báo Sài Gòn Giải phóng

22/09/2024