According to data from analytics firm LexisNexis, TSMC is the semiconductor company with the world's largest patent portfolio related to advanced chip packaging technology, followed by Samsung Electronics and Intel.
Advanced chip packaging is a key technology that helps extract maximum power from the latest microprocessor designs, making it essential for contract chipmakers to attract customers.
As of now, the Taiwanese semiconductor company owns 2,946 patents related to packaging technology, and is also the best quality manufacturer - based on the number of times they are cited by other companies.
South Korean electronics giant Samsung Electronics is firmly in second place in both quantity and quality, with 2,404 patents. In third place is Intel Corporation with 1,434.
“These are the leading companies that set the standard for the entire industry,” said LexisNexis managing director Marco Richter.
Intel, Samsung, and TSMC have been investing in advanced packaging technology since around 2015, when all three began adding to their patent portfolios. They are also the only three companies in the world that have or plan to build the most advanced and complex chip foundries.
Advanced packaging plays an important role in improving semiconductor design efficiency as packing more transistors onto silicon wafers becomes increasingly difficult.
Packaging technology allows manufacturers to assemble multiple chips, known as “chiplets,” in a stacked or adjacent manner on the same area.
Chiplets are also the technology that helps AMD gain an advantage in the server race with Intel.
In December 2022, Samsung established a dedicated team for advanced packaging despite having invested in this technology for many years.
Meanwhile, Intel said that the number of patents in TSMC's portfolio does not mean that the company has superior packaging technology than other businesses.
(According to Reuters)
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